1.SMT/PCB Circuit Board Soldering (Reflow Soldering, Wave Soldering)
Nitrogen purity: 99.99% or higher; 99.999% for high‑end processes, maintaining extremely low oxygen content inside the furnace.
Functions
Inhibit high‑temperature oxidation of solder, reducing solder balls, bridging, cold solder joints, blackened solder joints and voids;
Improve solder wettability, suitable for lead‑free soldering and soldering of miniature BGA/QFN components;
Reduce solder dross generation, extend equipment maintenance intervals, and enhance solder joint strength and reliability. It is widely adopted for automotive electronic circuit boards.
It is also applied in selective soldering and post‑solder nitrogen purging to remove dust and flux residues on board surfaces.
2.Semiconductor and Chip Manufacturing and Packaging
Wafer Manufacturing: In photolithography, etching, CVD thin‑film deposition, diffusion and annealing processes, nitrogen is used as protective gas, carrier gas and purge gas. The purity is ≥99.999%, and 99.9999% for some processes. It prevents oxidation and contamination of silicon wafers and metal thin‑films and guarantees the precision of nanoscale circuits.
Chip Packaging (IC, BGA): Nitrogen is filled in the environment for bonding, sintering and molding to protect gold wires and aluminum wires and avoid pin oxidation. Nitrogen is applied for chamber purging and bare chip storage under inert atmosphere to improve packaging reliability.
3.Production of Display Panels (LCD/OLED)
In OLED evaporation and organic‑material encapsulation processes, organic luminescent materials are highly susceptible to oxidation and failure upon exposure to oxygen. High‑purity nitrogen is introduced into sealed chambers to isolate air, so as to guarantee the luminous efficiency and service life of screens。
4.Lithium‑ion battery manufacturing (batteries for consumer electronics)